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  Datasheet File OCR Text:
 VDRM VDSM IT(AV)M IT(RMS) ITSM V(T0) rT
= = = = = = =
8000 8500 1200 1880 35x103 1.25 0.48
V V A A A V m
Phase Control Thyristor
5STP 12N8500
Doc. No. 5SYA1044-02 Nov. 04
* * * * *
Patented free-floating silicon technology Low on-state and switching losses Designed for traction, energy and industrial applications Optimum power handling capability Interdigitated amplifying gate
Blocking
Maximum rated values
1)
Symbol VDSM, VRSM VDRM, VRRM VRSM dV/dtcrit Parameter
Conditions f = 5 Hz, tp = 10 ms f = 50 Hz, tp = 10 ms tp = 5 ms, single pulse Exp. to 5360 V, Tvj = 90C Symbol Conditions IDSM IRSM
5STP 12N8500 5STP 12N8200 8500 V 8000 V 9000 V 8200 V 7700 V 8600 V 2000 V/s min typ
5STP 12N7800 7800 V 7300 V 8200 V
Characteristic values
max 1000 400
Unit mA mA
Forward leakage current Reverse leakage current
VDSM, Tvj = 90C VRSM, Tvj = 90C
Mechanical data
Maximum rated values
1)
Parameter Mounting force Acceleration Acceleration
Characteristic values
Symbol Conditions FM a a Device unclamped Device clamped
min 81
typ 90
max 108 50 100
Unit kN m/s m/s Unit kg mm mm mm
2 2
Parameter Weight Housing thickness Surface creepage distance
Symbol Conditions m H DS FM = 90 kN, Ta = 25 C
min 35.3 56
typ
max 2.9 36
Air strike distance Da 22 1) Maximum rated values indicate limits beyond which damage to the device may occur
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
5STP 12N8500
On-state
Maximum rated values
1)
Parameter Average on-state current RMS on-state current Peak non-repetitive surge current Limiting load integral Peak non-repetitive surge current Limiting load integral
Characteristic values
Symbol Conditions IT(AV)M IT(RMS) ITSM I2t ITSM I2t tp = 10 ms, Tvj = 90 C, VD = VR = 0 V tp = 8.3 ms, Tvj = 90 C, VD = VR = 0 V Half sine wave, Tc = 70C
min
typ
max 1200 1880 35x10
3
Unit A A A
6
6.13x10 38x10
3
A2s A
5.99x10 min typ max 2 1.25 0.48 Tvj = 25 C Tvj = 90 C Tvj = 25 C Tvj = 90 C 150 125 600 800
6
A2s Unit V V m mA mA mA mA
Parameter On-state voltage Threshold voltage Slope resistance Holding current Latching current
Symbol Conditions VT V(T0) rT IH IL IT = 1500 A, Tvj = 90 C IT = 700 A - 2100 A, Tvj= 90 C
Switching
Maximum rated values
1)
Parameter Critical rate of rise of onstate current Critical rate of rise of onstate current
Symbol Conditions di/dtcrit di/dtcrit Tvj = 90 C, ITRM = 2000 A, VD 5360 V, IFG = A, tr = 0.5 s Cont. f = 50 Hz Cont. f = 1Hz
min
typ
max 250 1000
Unit A/s A/s s
Circuit-commutated turn-off tq time
Characteristic values
Tvj = 90C, ITRM = 2000 A, VR = 200 V, diT/dt = -1 A/s, VD 0.67VDRM, dvD/dt = 20V/s
600
Parameter Recovery charge
Symbol Conditions Qrr Tvj = 90C, ITRM = A, VR = 200 V, diT/dt = -1 A/s VD = 0.4VRM, IFG = 2 A, tr = 0.5 s, Tvj = 25 C
min 2800
typ
max 3400
Unit As
Gate turn-on delay time
tgd
3
s
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA1044-02 Nov. 04 page 2 of 6
5STP 12N8500
Triggering
Maximum rated values
1)
Parameter Peak forward gate voltage Peak forward gate current Peak reverse gate voltage Average gate power loss
Characteristic values
Symbol Conditions VFGM IFGM VRGM PG(AV) Symbol Conditions VGT IGT VGD IGD Tvj = 25 C Tvj = 25 C VD = 0.4 x VDRM, Tvjmax = 90 C VD = 0.4 x VDRM, Tvjmax = 90C
min
typ
max 12 10 10
Unit V A V
see Fig. 9 min typ max 2.6 400 0.3 10 Unit V mA V mA
Parameter Gate-trigger voltage Gate-trigger current Gate non-trigger voltage Gate non-trigger current
Thermal
Maximum rated values
1)
Parameter Operating junction temperature range
Characteristic values
Symbol Conditions Tvj
min
typ
max 90
Unit C C Unit K/kW K/kW K/kW K/kW K/kW
Storage temperature range Tstg Parameter Symbol Conditions Double-side cooled Fm = 81...108 kN Anode-side cooled Fm = 81...108 kN Cathode-side cooled Fm = 81...108 kN Double-side cooled Fm = 81...108 kN Single-side cooled Fm = 81...108 kN
-40 min typ
140 max 5.7 11.4 11.4 1 2
Thermal resistance junction Rth(j-c) to case Rth(j-c)A Rth(j-c)C Thermal resistance case to Rth(c-h) heatsink Rth(c-h)
Analytical function for transient thermal impedance:
Zth(j-c) (t) = R th i (1 - e-t/ i )
i =1
i Rth i(K/kW) i(s) 1 3.400 0.8685 2 1.260 0.1572 3 0.680 0.0219 4 0.350 0.0078 Fig. 1 Transient thermal impedance junction-to case.
n
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA1044-02 Nov. 04 page 3 of 6
5STP 12N8500
On-state characteristic model:
VT = A + B iT + C ln(iT +1) + D IT
Valid for iT = 200 - 4000 A A 1.9700e+0 B -1.8000e-4 C -3.0000e-1 D 6.2000e-2
Fig. 2 On-state characteristics. Tj=125C, 10ms half sine
Fig. 3 Max. on-state voltage characteristics
Tcase (C)
90 Double-sided cooling
85
DC 180 rectangular 180 sine 120 rectangular
80
75
70 0 200 400 600 800 1000 1200 1400 1600 1800
ITAV (A)
Fig. 4 On-state power dissipation vs. mean on-state current. Turn-on losses excluded.
Doc. No. 5SYA1044-02 Nov. 04
Fig. 5 Max. permissible case temperature vs. mean on-state current.
page 4 of 6
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
5STP 12N8500
5STP 12N8500
Fig. 6 Surge on-state current vs. pulse length. Halfsine wave.
IG (t) 100 % 90 % IGM IGM IGon diG/dt tr tp(IGM) 2..5 A 1.5 IGT 2 A/s 1 s 5...20 s
Fig. 7 Surge on-state current vs. number of pulses. Half-sine wave, 10 ms, 50Hz.
diG/dt 10 % tr tp (IGM) tp (IGon) t
IGon
Fig. 8 Recommended gate current waveform.
Fig. 9 Max. peak gate power loss.
IRM(A)
400 300
ITRM = 2000 A
200 max
Tj = Tjmax
min
102
90 80 70 5STP 12N8500 60 50 40 30
1
2
3
4
5 6 7 8 910
30 20 -diT/dt (A/s)
Fig. 10 Recovery charge vs. decay rate of on-state current.
Fig. 11 Peak reverse recovery current vs. decay rate of on-state current.
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA1044-02 Nov. 04 page 5 of 6
5STP 12N8500
Fig. 12 Device Outline Drawing.
Related application notes:
Doc. Nr 5SYA2020 5SYA2034 5SYA 2036 Titel Design of RC-Snubber for Phase Control Applications Gate-drive Recommendations for PCT's Recommendations regarding mechanical clamping of Press Pack High Power Semiconductors
Please refer to http://www.abb.com/semiconductors for actual versions.
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
ABB Switzerland Ltd Semiconductors Fabrikstrasse 3 CH-5600 Lenzburg, Switzerland Telephone Fax Email Internet +41 (0)58 586 1419 +41 (0)58 586 1306 abbsem@ch.abb.com www.abb.com/semiconductors
Doc. No. 5SYA1044-02 Nov. 04


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